{"version":"1.0","provider_name":"Microsoft Research","provider_url":"https:\/\/www.microsoft.com\/en-us\/research","author_name":"Hang Dong","author_url":"https:\/\/www.microsoft.com\/en-us\/research\/people\/hangdong\/","title":"Wafer Yield Prediction using Derived Spatial Variables - Microsoft Research","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"f98aCuCBJa\"><a href=\"https:\/\/www.microsoft.com\/en-us\/research\/publication\/wafer-yield-prediction-using-derived-spatial-variables\/\">Wafer Yield Prediction using Derived Spatial Variables<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.microsoft.com\/en-us\/research\/publication\/wafer-yield-prediction-using-derived-spatial-variables\/embed\/#?secret=f98aCuCBJa\" width=\"600\" height=\"338\" title=\"&#8220;Wafer Yield Prediction using Derived Spatial Variables&#8221; &#8212; Microsoft Research\" data-secret=\"f98aCuCBJa\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","description":"Unreliable chips tend to form spatial clusters on semiconductor wafers. The spatial patterns of these defects are largely reflected in functional testing results. However, the spatial cluster information of unreliable chips has not been fully used to predict the performance in field use in the literature. This paper proposes a novel wafer yield prediction model [&hellip;]"}