{"id":152658,"date":"2003-01-01T00:00:00","date_gmt":"2003-01-01T00:00:00","guid":{"rendered":"https:\/\/www.microsoft.com\/en-us\/research\/msr-research-item\/new-direct-approaches-to-robust-sound-source-localization\/"},"modified":"2018-10-16T20:08:41","modified_gmt":"2018-10-17T03:08:41","slug":"new-direct-approaches-to-robust-sound-source-localization","status":"publish","type":"msr-research-item","link":"https:\/\/www.microsoft.com\/en-us\/research\/publication\/new-direct-approaches-to-robust-sound-source-localization\/","title":{"rendered":"New Direct Approaches to Robust Sound Source Localization"},"content":{"rendered":"<div class=\"asset-content\">\n<p>When more than two microphones are used, the traditional time-delay-of-arrival (TDOA) based sound source localization (SSL) approach involves two steps. The first step computes TDOA for each microphone pair, and the second step combines these estimates. This two-step process discards relevant information in the first step, thus degrading the SSL accuracy and robustness. Although less used, one-step processes do exist. In this paper, we review these processes, create a unified framework, and introduce two new one-step algorithms. We compare our proposed approaches against existing 1 and 2-step approaches and demonstrate significantly better SSL performance.<\/p>\n<\/div>\n<p><!-- .asset-content --><\/p>\n","protected":false},"excerpt":{"rendered":"<p>When more than two microphones are used, the traditional time-delay-of-arrival (TDOA) based sound source localization (SSL) approach involves two steps. The first step computes TDOA for each microphone pair, and the second step combines these estimates. This two-step process discards relevant information in the first step, thus degrading the SSL accuracy and robustness. Although less [&hellip;]<\/p>\n","protected":false},"featured_media":0,"template":"","meta":{"msr-url-field":"","msr-podcast-episode":"","msrModifiedDate":"","msrModifiedDateEnabled":false,"ep_exclude_from_search":false,"_classifai_error":"","msr-author-ordering":[{"type":"user_nicename","value":"yongrui"},{"type":"user_nicename","value":"dinei"}],"msr_publishername":"Institute of Electrical and Electronics Engineers, Inc.","msr_publisher_other":"","msr_booktitle":"","msr_chapter":"","msr_edition":"","msr_editors":"","msr_how_published":"","msr_isbn":"","msr_issue":"","msr_journal":"","msr_number":"MSR-TR-2003-02","msr_organization":"","msr_pages_string":"5","msr_page_range_start":"5","msr_page_range_end":"","msr_series":"","msr_volume":"","msr_copyright":"\u00a9 2003 IEEE. Personal use of this material is permitted. However, permission to reprint\/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.","msr_conference_name":"","msr_doi":"","msr_arxiv_id":"","msr_s2_paper_id":"","msr_mag_id":"","msr_pubmed_id":"","msr_other_authors":"","msr_other_contributors":"","msr_speaker":"","msr_award":"","msr_affiliation":"","msr_institution":"Microsoft 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