{"id":164495,"date":"2012-01-01T00:00:00","date_gmt":"2012-01-01T00:00:00","guid":{"rendered":"https:\/\/www.microsoft.com\/en-us\/research\/msr-research-item\/combining-3d-printing-and-printable-electronics\/"},"modified":"2018-10-16T20:19:36","modified_gmt":"2018-10-17T03:19:36","slug":"combining-3d-printing-and-printable-electronics","status":"publish","type":"msr-research-item","link":"https:\/\/www.microsoft.com\/en-us\/research\/publication\/combining-3d-printing-and-printable-electronics\/","title":{"rendered":"Combining 3D Printing and Printable Electronics"},"content":{"rendered":"
A platform that enables the integration of conductive traces and printed three dimensional mechanical structures has been developed. We discuss the development of the platform and address issues that arise when combining 3D printing and printable electronics. We demonstrate a rapid prototyped three dimensional conductive trace and propose future applications for the platform.<\/p>\n<\/div>\n
<\/p>\n","protected":false},"excerpt":{"rendered":"
A platform that enables the integration of conductive traces and printed three dimensional mechanical structures has been developed. We discuss the development of the platform and address issues that arise when combining 3D printing and printable electronics. We demonstrate a rapid prototyped three dimensional conductive trace and propose future applications for the platform.<\/p>\n","protected":false},"featured_media":0,"template":"","meta":{"msr-url-field":"","msr-podcast-episode":"","msrModifiedDate":"","msrModifiedDateEnabled":false,"ep_exclude_from_search":false,"_classifai_error":"","footnotes":""},"msr-content-type":[3],"msr-research-highlight":[],"research-area":[13552],"msr-publication-type":[193716],"msr-product-type":[],"msr-focus-area":[],"msr-platform":[],"msr-download-source":[],"msr-locale":[268875],"msr-post-option":[],"msr-field-of-study":[],"msr-conference":[],"msr-journal":[],"msr-impact-theme":[],"msr-pillar":[],"class_list":["post-164495","msr-research-item","type-msr-research-item","status-publish","hentry","msr-research-area-hardware-devices","msr-locale-en_us"],"msr_publishername":"ACM","msr_edition":"Proceedings of TEI 2012 Works in Progress","msr_affiliation":"","msr_published_date":"2012-02-19","msr_host":"","msr_duration":"","msr_version":"","msr_speaker":"","msr_other_contributors":"","msr_booktitle":"","msr_pages_string":"","msr_chapter":"","msr_isbn":"","msr_journal":"","msr_volume":"","msr_number":"","msr_editors":"","msr_series":"","msr_issue":"","msr_organization":"","msr_how_published":"","msr_notes":"","msr_highlight_text":"","msr_release_tracker_id":"","msr_original_fields_of_study":"","msr_download_urls":"","msr_external_url":"","msr_secondary_video_url":"","msr_longbiography":"","msr_microsoftintellectualproperty":1,"msr_main_download":"206219","msr_publicationurl":"","msr_doi":"","msr_publication_uploader":[{"type":"file","title":"07-sarik.done.pdf","viewUrl":"https:\/\/www.microsoft.com\/en-us\/research\/wp-content\/uploads\/2016\/02\/07-sarik.done_.pdf","id":206219,"label_id":0}],"msr_related_uploader":"","msr_attachments":[{"id":206219,"url":"https:\/\/www.microsoft.com\/en-us\/research\/wp-content\/uploads\/2016\/02\/07-sarik.done_.pdf"}],"msr-author-ordering":[{"type":"text","value":"John Sarik","user_id":0,"rest_url":false},{"type":"user_nicename","value":"dab","user_id":31499,"rest_url":"https:\/\/www.microsoft.com\/en-us\/research\/wp-json\/microsoft-research\/v1\/researchers?person=dab"},{"type":"user_nicename","value":"nvillar","user_id":33139,"rest_url":"https:\/\/www.microsoft.com\/en-us\/research\/wp-json\/microsoft-research\/v1\/researchers?person=nvillar"},{"type":"user_nicename","value":"jws","user_id":32459,"rest_url":"https:\/\/www.microsoft.com\/en-us\/research\/wp-json\/microsoft-research\/v1\/researchers?person=jws"},{"type":"user_nicename","value":"shodges","user_id":33628,"rest_url":"https:\/\/www.microsoft.com\/en-us\/research\/wp-json\/microsoft-research\/v1\/researchers?person=shodges"}],"msr_impact_theme":[],"msr_research_lab":[],"msr_event":[],"msr_group":[144767],"msr_project":[171199],"publication":[],"video":[],"download":[],"msr_publication_type":"inproceedings","related_content":{"projects":[{"ID":171199,"post_title":"Circuit Stickers and Conductive Printing","post_name":"circuit-stickers-and-conductive-printing","post_type":"msr-project","post_date":"2013-09-01 15:56:23","post_modified":"2023-11-28 09:22:36","post_status":"publish","permalink":"https:\/\/www.microsoft.com\/en-us\/research\/project\/circuit-stickers-and-conductive-printing\/","post_excerpt":"Circuit stickers are a new way to build electronic prototypes very quickly. Physical interface elements such as LEDs, sounders, buttons and sensors are stuck onto a cheap and easy-to-make substrate. We use a special type of conductive double-sided tape and the substrate\u00a0provides the necessary electrical connectivity. The resulting\u00a0assembly may include a battery for standalone operation, or it can be interfaced to a microcontroller or PC. 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